The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jun. 03, 2014
Denso Corporation, Kariya-city, Aichi-pref., JP;
Norihisa Imaizumi, Kariya, JP;
Yuuki Sanada, Kariya, JP;
Masayuki Takenaka, Kariya, JP;
Shinya Uchibori, Kariya, JP;
Kengo Oka, Kariya, JP;
Tasuke Fukuda, Kariya, JP;
Keitarou Nakama, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.