The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Aug. 08, 2016
Toshiba Memory Corporation, Tokyo, JP;
Toshiba Memory Corporation, Tokyo, JP;
Abstract
A semiconductor manufacturing method includes forming a first metal film on a semiconductor wafer by plating, ejecting liquid from a washer bar spaced from the wafer while rotating at least one of the washer and the semiconductor, and forming a second metal film on the first metal film. A plurality of nozzles are located on the washer bar and displaced from the position of the washer bar opposed to the center of the wafer, and a greater number of nozzles are adjacent the peripheral area of the semiconductor wafer than the central area of the semiconductor wafer. The nozzles in the peripheral area of the wafer eject the washing liquid in a direction inclined from the direction of the washer bar, and a nozzle arranged on the central area of the one main surface of the semiconductor wafer ejects the washing liquid towards the center position of the semiconductor wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile