The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jul. 25, 2013
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Wei Shao, Singapore, SG;

Fan Zhang, Singapore, SG;

Vish Srinivasan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/485 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/76847 (2013.01); H01L 23/485 (2013.01); H01L 21/76877 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes forming a conductive plug that at least partially fills a contact seam void. The contact seam void is formed in a contact that extends through an ILD layer of dielectric material overlying a device region. A metallization layer is deposited overlying the contact.


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