The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jun. 29, 2016
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/683 (2006.01); C09J 183/04 (2006.01); H01L 21/302 (2006.01); C09J 109/06 (2006.01); H01L 21/02 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 25/08 (2006.01); B32B 25/20 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/12 (2013.01); B32B 9/04 (2013.01); B32B 9/043 (2013.01); B32B 9/045 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/325 (2013.01); C09J 109/06 (2013.01); C09J 183/04 (2013.01); H01L 21/02013 (2013.01); H01L 21/302 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2264/105 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/302 (2013.01); B32B 2307/50 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract
A temporary bonding arrangement for wafer processing is provided comprising a first temporary bond layer (A) of thermoplastic resin, a second temporary bond layer (B) of thermosetting siloxane polymer, and a third temporary bond layer (C) of thermosetting polymer. Layer (B) is cured with a curing catalyst contained in layer (A) which is laid contiguous to layer (B). An adhesive layer of uniform thickness is formed without insufficient step coverage and other failures.