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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9941137 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Dec. 27, 2015

Substrate planarizing method and dropping amount calculating method

Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Kazuhiro Takahata, Kuwana, JP;

Eiichi Soda, Mie, JP;

Assignee:

TOSHIBA MEMORY CORPORATION, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Allan Olsen

Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/027 (2006.01); H01L 21/3105 (2006.01); G03F 7/00 (2006.01); H01L 21/302 (2006.01); H01L 21/306 (2006.01); H01L 21/304 (2006.01); G05B 19/402 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); G03F 7/0002 (2013.01); H01L 21/0274 (2013.01); H01L 21/302 (2013.01); H01L 21/31058 (2013.01);
Abstract

According to one embodiment, a substrate planarizing method includes dropping from above a substrate with topography, resist whose amount is determined in accordance with the volume of a concave portion according to the topography. The distance between a blank template with a flat pressing plane and the substrate is set to a predetermined distance and then the resist is cured. After that, the blank template is released from the resist and the substrate is entirely etched. The amount of resist to be dropped on the substrate is adjusted for units of shot of the substrate.

Find Patent Forward Citations

Takahata, Kazuhiro. (2018). Substrate planarizing method and dropping amount calculating method (U.S. Patent No. 9941137). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9941137

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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