The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jan. 07, 2016
International Business Machines Corporation, Armonk, NY (US);
Hemlata Gupta, Hopewell Junction, NY (US);
Debjit Sinha, Wappingers Falls, NY (US);
Chandramouli Visweswariah, Croton-on-Hudson, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A system to improve performance of a semiconductor chip design includes a hierarchical analysis module that determines a hierarchical arrangement of the semiconductor chip design. The hierarchical arrangement includes a plurality of arcs located at different levels internal to the semiconductor chip design. The different levels include a macro level, a unit level and a core level. The system further includes a timing/load analysis module that determines first timing characteristics of at least one first arc in the macro level based on a first load applied to the at least one first arc. The system further determines second timing characteristics of at least one second arc in at least one of the unit level and the core level based on the first timing characteristics, with a portion of the second timing characteristics determined irrespective of the first load.