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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9939575 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Feb. 27, 2014

Method of manufacturing light guide plate, lighting device, and display device

Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Yoshinobu Hirayama, Osaka, JP;

Tetsuyuki Takemoto, Osaka, JP;

Masaki Kageyama, Yonago, JP;

Masanori Ehara, Yonago, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Jun Yoo

Int. Cl.
CPC ...
F21V 8/00 (2006.01); B29D 11/00 (2006.01); G02F 1/1335 (2006.01); B29C 59/00 (2006.01); B29C 59/02 (2006.01); G03F 7/00 (2006.01); B29K 69/00 (2006.01); B29K 105/00 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/0065 (2013.01); B29C 59/002 (2013.01); B29C 59/005 (2013.01); B29C 59/022 (2013.01); B29D 11/00721 (2013.01); G02B 6/002 (2013.01); G02F 1/133608 (2013.01); G03F 7/0002 (2013.01); B29C 2059/023 (2013.01); B29K 2069/00 (2013.01); B29K 2105/256 (2013.01); B29L 2011/0075 (2013.01); G02F 2001/133628 (2013.01);
Abstract

A method of manufacturing a light guide plate includes steps of cutting a light guide plate base material with a frame-shaped die into a die-cut plateincluding side surfaces each having a rectangular shape and performing thermal-imprinting process. In thermal-imprinting process, a processing surfaceof a plate surface of a heated processing boardis pressed against one of the side surfacesof the die-cut plateto thermally imprint a pattern of the processing surfaceof the processing boardon the one of the side surfacesof the die-cut plate. The processing surfacehaving a shape that is recessed more at a portion thereof opposite a middle of a long dimension of the one of the side surfacesthan a portion thereof opposite ends of the long dimension of the one of the side surfacesis pressed against the side surface

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