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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9939125 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Dec. 18, 2015

Lens arrays and mountings

Applicant:

Schreder, Brussels, BE;

Inventors:

Luigi Donato, Oreye, BE;

Hervé Damoiseau, Saive, BE;

Assignee:

SCHREDER, Brussels, BE;

Attorney:

Christensen O'Connor Johnson Kindness PLLC

Primary Examiner:

Edwyn Labaze

Int. Cl.
CPC ...
F21V 1/00 (2006.01); F21V 5/00 (2018.01); G02B 19/00 (2006.01); F21V 17/00 (2006.01); G02B 3/00 (2006.01); F21V 17/06 (2006.01); F21V 23/00 (2015.01); F21V 5/04 (2006.01); F21V 7/00 (2006.01); F21W 131/103 (2006.01); F21K 9/20 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01); F21K 9/69 (2016.01);
U.S. Cl.
CPC ...
F21V 5/007 (2013.01); F21V 17/005 (2013.01); F21V 17/06 (2013.01); F21V 23/005 (2013.01); G02B 3/0056 (2013.01); G02B 3/0075 (2013.01); G02B 19/0066 (2013.01); F21K 9/20 (2016.08); F21K 9/69 (2016.08); F21V 5/04 (2013.01); F21V 7/0091 (2013.01); F21W 2131/103 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08);
Abstract

An LED module is formed using a method of mounting secondary lens arrays over light-emitting diode arrays on a printed circuit board. In the LED module, a lens array assembly is mounted to a printed circuit board. The lens array assembly comprises a silicone free form lens array which is mounted in a lens holder by aligning markings on the lens holder with markings on the free form lens array. The lens array assembly is correctly positioned, in an x-y plane, on the printed circuit board by the engagement of positioning pins formed on a surface of the free form lens array with corresponding recesses formed in the printed circuit board and is retained in the correct position by clips integrally formed with the lens holder. The positioning pins are shaped to allow for thermal changes due to the operating temperature range of the LED module.

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