The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Oct. 24, 2012
Applicants:

Institut Químic DE Sarrià Cets Fundació Privada, Barcelona, ES;

Pjm Pujadas, S.a., Rubí, ES;

Inventors:

Jorge Parellada Llobet, Barcelona, ES;

Jordi Arbusá Amorós, Barcelona, ES;

Salvador Borrós Gómez, Barcelona, ES;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 5/00 (2013.01);
Abstract

The present invention relates to an adhesive composition comprising a component A and a component B, wherein said component A comprises bisphenol A resin; a hydrophilic solvent, preferably acetone or ethanol or mixtures thereof; and silica gel (SiO) or alumina (AlO) and said component B comprises aliphatic or aromatic polyamines, preferably polyamidoamines; polythiol; a combination of primary and tertiary amines, preferably 1-(2-aminoethyl)piperazine and ethylenediamine; optionally a hydrophilic solvent and optionally silica (SiO) or alumina (AlO) gel. Said composition has the advantage that it cures, in addition to under dry conditions, in the presence of water or humidity in a time of 30 minutes as much and is flexible. The present invention also relates to a process for obtaining said adhesive composition. The present invention also relates to the use of the adhesive composition of the present invention for the bonding of any type of material, both in a medium with the presence of water and without it, and of materials where a flexible behavior is necessary.


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