The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jul. 11, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Alfons Dehe, Reutlingen, DE;
Stephan Pindl, Ergoldsbach, DE;
Bernhard Knott, Neumarkt, DE;
Carsten Ahrens, Pettendorf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H04R 19/04 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00825 (2013.01); B81C 1/00873 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81C 2201/017 (2013.01); B81C 2201/053 (2013.01); H04R 2201/003 (2013.01);
Abstract
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.