The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Apr. 12, 2016
Applicant:

Shiroki Corporation, Fujisawa-shi, JP;

Inventors:

Takashi Harada, Fujisawa, JP;

Katsuhisa Fukui, Fujisawa, JP;

Yasuhisa Suzuki, Fujisawa, JP;

Assignee:

SHIROKI CORPORATION, Fujisawa-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B60J 10/18 (2016.01); B60J 10/75 (2016.01); B29C 47/00 (2006.01); B60J 10/16 (2016.01); B29K 23/00 (2006.01); B29L 31/30 (2006.01); B29L 31/26 (2006.01); B29L 31/00 (2006.01); B29C 47/06 (2006.01);
U.S. Cl.
CPC ...
B60J 10/18 (2016.02); B29C 47/003 (2013.01); B60J 10/16 (2016.02); B60J 10/75 (2016.02); B29C 47/062 (2013.01); B29C 47/065 (2013.01); B29K 2023/12 (2013.01); B29L 2031/006 (2013.01); B29L 2031/265 (2013.01); B29L 2031/302 (2013.01);
Abstract

A belt molding includes: a molding body, which includes an inner wall, an outer wall, and a connection wall that connects an upper end of the inner wall and an upper end of the outer wall; a design lip, which is formed at the upper end of the inner wall of the molding body; and a design portion, wherein the design portion includes a first portion, which covers at least a part of the molding body, and a second portion, which covers at least a part of the design lip, and wherein a step is formed between the first portion and the second portion, such that a level of a surface of the first portion is different from a level of a surface of the second portion.


Find Patent Forward Citations

Loading…