The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jan. 19, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Katsutomo Tsukahara, Shiojiri, JP;

Motoki Takabe, Shiojiri, JP;

Eiju Hirai, Azumino, JP;

Yoshihiro Hokari, Azumino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1632 (2013.01); B41J 2/1634 (2013.01); B41J 2/1643 (2013.01); B41J 2/1646 (2013.01); H01L 41/0475 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/18 (2013.01);
Abstract

A piezoelectric device includes a substrate that includes a piezoelectric element formed by stacking a piezoelectric layer, a first electrode and a second electrode such that the piezoelectric layer is interposed between the first electrode and the second electrode; and a wiring substrate that includes a driving element providing a signal for driving the piezoelectric element to the substrate. The substrate has an inspection region where a piezoelectric element for inspection which is a portion of the piezoelectric element is disposed. The wiring substrate has an electrode inspection region including an electrode to be inspected that is electrically connected to the piezoelectric element for inspection and is disposed on a surface side opposite to the substrate, and a flexible substrate mounting region which is disposed on the surface side opposite to the substrate, and is connected to a flexible substrate. In plan view from a stacking direction of the substrate and the wiring substrate, the inspection region partially overlaps at least one of the inspection electrode region and the flexible substrate mounting region.


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