The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

May. 13, 2017
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Garrett E. Clark, Corvallis, OR (US);

Chris Bakker, Corvallis, OR (US);

Mark H. MacKenzie, Corvallis, OR (US);

Glenn D. McCloy, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04563 (2013.01); B41J 2/04586 (2013.01);
Abstract

Staggered fluid ejection dies may include first, second and third fluid ejection dies, each of the dies having fluid feed passages between first and second long edges. And electrical interconnect may extend from a location proximate the first long edge of each of the fluid ejection dies. A temperature sensor may be supported proximate the second long edge of each of the fluid ejection dies. Each of the fluid ejection dies may omit temperature sensors proximate the first long edge.


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