The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Feb. 21, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Rie Tsubo, Kanagawa, JP;
Kazuya Hayashibe, Kanagawa, JP;
Hiroshi Tazawa, Kanagawa, JP;
Shunichi Kajiya, Kanagawa, JP;
Hiroshi Tanaka, Kanagawa, JP;
Toru Yatabe, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 33/42 (2006.01); B29C 33/56 (2006.01); B29C 43/02 (2006.01); B29C 59/04 (2006.01); B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
B29D 11/0048 (2013.01); B29C 33/424 (2013.01); B29C 33/56 (2013.01); B29C 43/021 (2013.01); B29C 59/04 (2013.01); B29C 2043/025 (2013.01); B29C 2059/023 (2013.01);
Abstract
A transfer mold includes a body, a first layer, and a second layer. The body has a projecting-and-recessed surface. The first layer contains an inorganic material and is disposed on the projecting-and-recessed surface of the body. The second layer contains fluorine and is disposed on a surface of the first layer. The average of hardness values of the projecting-and-recessed surface on which the first and second layers are disposed is 30 Hv or higher.