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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9937662 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Sep. 01, 2016

Shape memory thermal interface materials

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Joseph Kuczynski, North Port, FL (US);

Kevin M. O'Connell, Rochester, MN (US);

Chelsie M. Peterson, Dexter, MN (US);

Mark D. Plucinski, Toms River, NJ (US);

Timothy J. Tofil, Rochester, MN (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Jared L. Montanaro

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Joshel Rivera

Int. Cl.
CPC ...
B32B 41/00 (2006.01); B29C 65/56 (2006.01); B29C 35/08 (2006.01); B29C 35/16 (2006.01); B29C 47/00 (2006.01); B29C 71/00 (2006.01); B29C 65/48 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); B29K 105/16 (2006.01); B29K 105/00 (2006.01); B29L 31/18 (2006.01); B29L 31/34 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
B29C 65/562 (2013.01); B29C 35/0805 (2013.01); B29C 35/16 (2013.01); B29C 47/0004 (2013.01); B29C 47/0066 (2013.01); B29C 65/48 (2013.01); B29C 71/0072 (2013.01); H01L 21/4882 (2013.01); H01L 23/3675 (2013.01); B29K 2105/00 (2013.01); B29K 2105/167 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/18 (2013.01); B29L 2031/34 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.

Find Patent Forward Citations

Kuczynski, Joseph. (2018). Shape memory thermal interface materials (U.S. Patent No. 9937662). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9937662

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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