The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Mar. 24, 2016
Applicant:

Cardiac Pacemakers, Inc., St. Paul, MN (US);

Inventors:

Patrick J. Barry, North St. Paul, MN (US);

Randy White, Blaine, MN (US);

Steven A. Kubow, Hugo, MN (US);

Scott A. Spadgenske, Buffalo, MN (US);

David A. Chizek, Brooklyn Park, MN (US);

Jerald Sauber, Lino Lakes, MN (US);

Assignee:

Cardiac Pacemakers, Inc., St. Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/36 (2006.01); A61N 1/375 (2006.01); H01G 4/35 (2006.01); H03H 3/00 (2006.01); H03H 7/01 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/22 (2006.01); H05K 3/30 (2006.01); H05K 5/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); H01G 4/35 (2013.01); H03H 3/00 (2013.01); H03H 7/17 (2013.01); H05K 1/0213 (2013.01); H05K 1/184 (2013.01); H05K 3/10 (2013.01); H05K 3/22 (2013.01); H05K 3/303 (2013.01); H05K 5/0247 (2013.01); H05K 3/284 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10303 (2013.01);
Abstract

An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.


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