The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jun. 19, 2017
Applicant:

Second Sight Medical Products, Inc., San Fernando, CA (US);

Inventors:

Jerry Ok, Canyon Country, CA (US);

Robert J Greenberg, Los Angeles, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 29/00 (2006.01); B32B 37/00 (2006.01); B29C 65/00 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); C04B 37/00 (2006.01); H05K 3/12 (2006.01); B32B 37/14 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4061 (2013.01); B32B 37/14 (2013.01); C04B 37/00 (2013.01); H05K 3/0044 (2013.01); H05K 3/0047 (2013.01); H05K 3/12 (2013.01); H05K 3/1225 (2013.01); H05K 3/4623 (2013.01); H05K 1/0306 (2013.01); H05K 3/005 (2013.01); H05K 3/4614 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09609 (2013.01); H05K 2203/1147 (2013.01); Y10T 156/10 (2015.01);
Abstract

A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.


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