The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Oct. 18, 2012
Applicant:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Mark E. Andresen, Cary, NC (US);

Virginia Ott, Apex, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/308 (2013.01); H05K 3/0047 (2013.01); H05K 2201/044 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10871 (2013.01); H05K 2203/0207 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49147 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.


Find Patent Forward Citations

Loading…