The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jul. 28, 2015
Applicant:

Triquint Semiconductor, Inc., Hillsboro, OR (US);

Inventors:

Craig Steinbeiser, Allen, TX (US);

Khiem Dinh, Plano, TX (US);

Anthony Chiu, Richardson, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H05K 9/003 (2013.01); H05K 9/0037 (2013.01); H05K 2203/043 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49016 (2015.01); Y10T 29/49018 (2015.01);
Abstract

Embodiments of the present disclosure describe a method of fabricating a multi-channel modulator driver with an enclosure. After a substrate is provided, components of a multi-channel modulator driver are attached to the substrate. Herein, the components include first components associated with a first channel and second components associated with a second channel. Next, an enclosure is attached to the substrate to cover the multi-channel modulator driver. The enclosure has a wall disposed between the first components and the second components, and a top region coupled with the wall. The enclosure and the wall are composed of an electrically conductive polymer. The wall includes a first portion that has the electrically conductive polymer covered by a metal film and a second portion that has the electrically conductive polymer not covered by the metal film.


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