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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9936583 B1

PDFFull Text
Date of Patent:
Apr. 03, 2018

Filed:

Oct. 29, 2014

Wiring board and mounting structure using the same

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Katsura Hayashi, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Rhadames J Alonzo Miller

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/4846 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/17 (2013.01); H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 1/115 (2013.01); H05K 3/0044 (2013.01); H05K 3/4673 (2013.01); H05K 3/4697 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15747 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/025 (2013.01);
Abstract

A wiring board is provided which includes an insulating layer; and a frame body disposed on the insulating layer. The frame body is provided with a through-hole. The insulating layer has a concave portion in one main surface on a frame body side. In a plan view of the wiring board, the concave portion has a first portion positioned at the through-hole, and a second portion which is positioned at the frame body and is continuous with the first portion. An air gap is formed between the frame body and the insulating layer in the second portion.

Find Patent Forward Citations

Hayashi, Katsura. (2018). Wiring board and mounting structure using the same (U.S. Patent No. 9936583). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9936583

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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