The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jan. 14, 2015
Applicant:

Vlt, Inc., Sunnyvale, CA (US);

Inventors:

Patrizio Vinciarelli, Boston, MA (US);

Robert Joseph Balcius, Methuen, MA (US);

Steven P. Sadler, Billerica, MA (US);

Mark Andrew Thompson, Royalston, MA (US);

Assignee:

VLT, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 3/36 (2013.01); B23K 2001/12 (2013.01);
Abstract

Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.


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