The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Jun. 06, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Ai Kiar Ang, Singapore, SG;
Michael Lauri, Montgomery, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 1/14 (2006.01); H01L 23/495 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01L 21/4839 (2013.01); H01L 23/49537 (2013.01); H01L 23/49555 (2013.01); H01L 23/49565 (2013.01); H01L 23/49575 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05K 1/0313 (2013.01); H05K 1/144 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 3/328 (2013.01); H05K 3/341 (2013.01); H05K 3/3421 (2013.01); H05K 3/3426 (2013.01); H01L 2225/1029 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10227 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10962 (2013.01); Y02P 70/613 (2015.11);
Abstract
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.