The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Oct. 01, 2014
Applicant:

Hitachi Automotive Systems, Ltd., Hiachinaka-shi, Ibaraki, JP;

Inventors:

Tatsuya Nakazawa, Hitachinaka, JP;

Yuji Sobu, Hitachinaka, JP;

Hidenori Shinohara, Hitachinaka, JP;

Yoshiharu Yamashita, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 3/335 (2006.01); B60L 1/00 (2006.01); H02M 3/00 (2006.01); H02M 1/32 (2007.01); H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
H02M 3/33569 (2013.01); B60L 1/00 (2013.01); H02M 1/32 (2013.01); H02M 3/00 (2013.01); H02M 3/33592 (2013.01); H05K 7/1432 (2013.01); H05K 7/2039 (2013.01); B60L 2210/12 (2013.01); H02M 2001/327 (2013.01); Y02T 10/7233 (2013.01);
Abstract

To achieve reduction in size and reduction in cost of a DC-DC converter apparatus. Rectifier elements and are installed onto a metal base, and a drive circuit board is installed to an upper part of the rectifier element. Each terminal of the rectifier elements and is soldered to the drive circuit board. Three terminals of the rectifier elements are soldered, respectively, to a drive signal wiring pattern, a high-potential-side main current wiring pattern, and a low-potential-side main current wiring pattern of the board. A pair of output terminals of a transformer is connected to at least the pair of high-potential-side main current wiring patterns using high-potential-side metal conductors.


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