The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jan. 22, 2016
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Kuang-Jung Chen, Hsinchu County, TW;

Shu-Tang Yeh, Taichung, TW;

Yung-Sheng Wang, Taichung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 17/06 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 17/06 (2013.01); B32B 27/06 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); H01L 51/525 (2013.01); H01L 51/5246 (2013.01); H01L 51/5259 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2307/546 (2013.01); B32B 2307/724 (2013.01); B32B 2307/726 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B32B 2439/62 (2013.01); B32B 2457/20 (2013.01); B32B 2553/00 (2013.01); H01L 2251/55 (2013.01); Y10T 428/239 (2015.01);
Abstract

A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10gram/cm.


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