The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jul. 22, 2015
Applicant:

Apollo Precision (Kunming) Yuanhong Limited, Kunming, Yunan, CN;

Inventors:

Jason S. Corneille, San Jose, CA (US);

Michael Meyers, San Jose, CA (US);

Adam C. Sherman, Newark, CA (US);

Nazir Ahmad, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0465 (2014.01); H01L 31/05 (2014.01); H01L 31/048 (2014.01); H01L 31/052 (2014.01); H01L 31/18 (2006.01); H01L 31/02 (2006.01); H02S 20/23 (2014.01); H02S 20/25 (2014.01); H02S 40/36 (2014.01); H02S 40/42 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0504 (2013.01); H01L 31/02013 (2013.01); H01L 31/0465 (2014.12); H01L 31/0481 (2013.01); H01L 31/05 (2013.01); H01L 31/052 (2013.01); H01L 31/18 (2013.01); H01L 31/186 (2013.01); H02S 20/23 (2014.12); H02S 20/25 (2014.12); H02S 40/36 (2014.12); H02S 40/42 (2014.12); Y02B 10/12 (2013.01); Y02E 10/50 (2013.01);
Abstract

Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.


Find Patent Forward Citations

Loading…