The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Nov. 03, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sung Hyun Moon, Yongin-si, KR;

Seong Jae Hong, Hwaseong-si, KR;

Kyu Jong Cho, Hwaseong-si, KR;

Seung Won Kang, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/62 (2013.01);
Abstract

Provided are a package substrate and a light emitting device package. The package substrate may include a base substrate having a plurality of mounting regions and a plurality of unit light emitting regions which include at least one of the plurality of mounting regions, a plurality of first circuit patterns disposed on the base substrate and connected to a plurality of light emitting devices in the plurality of mounting regions, a plurality of second circuit patterns connected to the plurality of unit light emitting regions, and a wire electrically connecting the plurality of second circuit patterns to the plurality of second circuit patterns, each of the plurality of second circuit patterns being connected to different unit light emitting regions, or electrically connecting the plurality of first circuit patterns to the plurality of second circuit patterns.


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