The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Jan. 19, 2017
Applicant:
Nanya Technology Corporation, Taoyuan, TW;
Inventors:
Po-Chun Lin, Changhua, TW;
Chin-Lung Chu, Taoyuan, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/1418 (2013.01); H01L 2224/16137 (2013.01);
Abstract
A semiconductor package includes a semiconductor device having an upper surface and a side, wherein the upper surface and the side form a corner of the semiconductor device. The semiconductor package also includes a lateral bump structure disposed on the side and implementing a lateral signal path of the semiconductor device. The semiconductor package further includes a vertical bump structure disposed over the upper surface and implementing a vertical signal path of the semiconductor device.