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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9935040 B1

PDFFull Text
Date of Patent:
Apr. 03, 2018

Filed:

May. 09, 2014

Semiconductor module

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Shunsuke Fushie, Tokyo, JP;

Yu Kawano, Tokyo, JP;

Yoshihito Asao, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorneys:

Sughrue Mion, PLLC

Richard C. Turner

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H02M 7/537 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/495 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 24/40 (2013.01); H02M 7/537 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H02M 7/003 (2013.01);
Abstract

A semiconductor module can be realized, which is formed by mounting an electronic component and a bus bar by solder on a lead frame including a plurality of terminals, wherein a solder flow suppressing section capable of restricting a direction of flow of solder on the lead frame is formed in the vicinity of the solder portion of the component mounted by solder, and by this configuration, positional deviation, such as rotation or movement of the mounted component, is suppressed and the size of the module can be made compact.

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Fushie, Shunsuke. (2018). Semiconductor module (U.S. Patent No. 9935040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9935040

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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