The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Nov. 10, 2014
Carsem (M) Sdn. Bhd., Ipoh, MY;
Lily Khor, Ipoh, MY;
Lynn Simporios Guirit, San Pedro, PH;
Carsem (M) SDN. BHD., Ipoh, MY;
Abstract
A leadframe with pre-molded cavities includes an outer frame and a plurality of units. Each unit includes a die pad and a plurality of leads. For each unit, a molding compound extends over a first portion of an upper surface of each of the leads that is located farthest from the die pad. The molding compound may also extend over an upper surface of the die pad. A second portion of the upper surface of each of the plurality of leads that is located nearest the die pad remains exposed outside the molding compound. A thickness of the molding compound covering the first portion of the upper surface of each of the leads is greater than a thickness of the molding compound covering the upper surface of the die pad.