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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9935032 B1

PDFFull Text
Date of Patent:
Apr. 03, 2018

Filed:

Apr. 14, 2017

Power electronics arrangement and vehicle with said arrangement

Applicant:

Semikron Elektronik Gmbh & Co. KG, Nümberg, DE;

Inventors:

Thomas Frank, Lauf, DE;

Christian Walter, Ansbach, DE;

Stefan Weiss, Hoechstadt, DE;

Thomas Ziegler, Piech, DE;

Assignee:

SEMIKRON ELEKTRONIK GMBH & CO. KG, Nuremberg, DE;

Attorneys:

Andrew F. Young, Esq.

Lackenbach Siegel, LLP

Primary Examiner:

John D Walters

Assistant Examiner:

James J Triggs

Int. Cl.
CPC ...
B60K 1/04 (2006.01); H01L 23/32 (2006.01); H01R 13/73 (2006.01); H01R 12/82 (2011.01); H01L 23/367 (2006.01); H01R 12/70 (2011.01); B60K 7/00 (2006.01); B60K 1/02 (2006.01); B66F 9/075 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/32 (2013.01); B60K 1/02 (2013.01); B60K 1/04 (2013.01); B60K 7/0007 (2013.01); B66F 9/07572 (2013.01); H01L 23/3672 (2013.01); H01R 12/7047 (2013.01); H01R 12/82 (2013.01); H01R 13/73 (2013.01); H05K 7/1432 (2013.01); B60K 2007/0061 (2013.01); H01L 2224/18 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48472 (2013.01); H01R 2201/26 (2013.01);
Abstract

A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.

Find Patent Forward Citations

Frank, Thomas. (2018). Power electronics arrangement and vehicle with said arrangement (U.S. Patent No. 9935032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9935032

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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