The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Mar. 13, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Yoshiki Kawazu, Kyoto, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/057 (2006.01); H01L 23/373 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/024 (2014.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01L 23/057 (2013.01); H01L 23/373 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01); H01L 31/02005 (2013.01); H01L 31/02325 (2013.01); H01S 5/02212 (2013.01); H01S 5/02284 (2013.01); H01S 5/02469 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electronic component housing package includes a substrate having an upper surface including a mount region on which an electronic component is to be mounted; a frame body disposed on the upper surface of the substrate, the frame body being provided with a through-hole portion; and an input/output member disposed on the frame body so as to block the through-hole portion, the input/output member having wiring conductors which are to be electrically connected to the electronic component, the wiring conductors extending to an inside and outside of the frame body and also extending along a lower surface of the input/output member on the outside of the frame body. The input/output member is provided with a cutout portion which is cut out so as to extend from a gap between the wiring conductors on the lower surface along the wiring conductors to an outer side surface of the input/output member.


Find Patent Forward Citations

Kawazu, Yoshiki. (2018). Electronic component housing package and electronic device (U.S. Patent No. 9935025). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9935025

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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