The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jul. 06, 2016
Applicants:

Joonmyoung Lee, Anyang-si, KR;

Woojin Kim, Yongin-si, KR;

Inventors:

Joonmyoung Lee, Anyang-si, KR;

Woojin Kim, Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01L 43/08 (2006.01); H01L 43/10 (2006.01); H01L 43/12 (2006.01); C23C 14/08 (2006.01); C23C 14/50 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3488 (2013.01); C23C 14/08 (2013.01); C23C 14/3464 (2013.01); C23C 14/505 (2013.01); H01J 37/32715 (2013.01); H01J 37/34 (2013.01); H01J 37/3426 (2013.01); H01J 37/3447 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01);
Abstract

A sputtering apparatus includes a process chamber in which a sputtering process is performed, a substrate holder provided in the process chamber and fixing a horizontal position of a substrate during the sputtering process, and a first sputter gun provided to be vertically spaced apart from the substrate in the process chamber. The first sputter gun is spaced apart from the substrate by a first horizontal distance during the sputtering process. The first sputter gun is fixed during the sputtering process. The first horizontal distance is a horizontal distance between the substrate and the first sputter gun when viewed from a plan view.


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