The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jul. 18, 2016
Applicant:

Vishay Dale Electronics, Inc., Columbus, NE (US);

Inventors:

Todd Wyatt, Columbus, NE (US);

Clark Smith, Columbus, NE (US);

Rod Brune, Columbus, NE (US);

Rocky Klabunde, Columbus, NE (US);

Assignee:

VISHAY DALE ELECTRONICS, LLC, Columbus, NE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/142 (2006.01); H01C 17/06 (2006.01); H01C 17/28 (2006.01);
U.S. Cl.
CPC ...
H01C 1/142 (2013.01); H01C 17/06 (2013.01); H01C 17/28 (2013.01);
Abstract

The present technology is directed toward a resistor and method of manufacturing the resistor. One or more layers of insulative material are formed on a length of resistive material. Portions of the one or more layers insulative material are removed from the resistive material in a pattern based on a predetermined approximate dimension and predetermined approximate resistance value. A first set of one or more conductive layers are formed on the portions of the resistive material exposed by the insulative coating to form a plurality of conductive pads on the resistive material between the patterned insulative material. The sets of conductive pads are probed to measure a preliminary resistance value between the sets of conductive pads. For one or more sets of conductive pads, a calculated amount of additional insulative material adjacent the respective conductive pads is removed based upon the preliminary resistance value between the corresponding set of conductive pads and a final resistance value to exposed additional portions of resistive material. The conductive pads and resistive material is cut at substantially the middle of each conductive pad to form pieces. A second set of one or more conductive layers are formed on the first set of one or more conductive layers at opposing ends of each piece, and the additionally exposed portions of the resistive material.


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