The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Oct. 20, 2015
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Yoshitaka Yoshino, Tokyo, JP;
Satoru Tsuboi, Kanagawa, JP;
Makoto Makishima, Saitama, JP;
Tomomichi Murakami, Tokyo, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 11/18 (2006.01); H05K 9/00 (2006.01); H01B 11/02 (2006.01); H01B 9/00 (2006.01); H01B 1/02 (2006.01); H01B 11/20 (2006.01);
U.S. Cl.
CPC ...
H01B 11/1895 (2013.01); H01B 1/026 (2013.01); H01B 9/006 (2013.01); H01B 11/02 (2013.01); H01B 11/20 (2013.01); H05K 9/0075 (2013.01);
Abstract
Provided is a cable including: at least two signal cables formed of first and second signal cables for differential transmission; a third cable for ground; a fourth cable for power supply; a metal sheet adapted to cover the first and second signal cables; a coating material adapted to house the first and second signal cables covered with the metal sheet, and the third and fourth cables; and a magnetic powder-mixed resin filled into an inner space of the coating material and prepared by mixing magnetic powder with a resin.