The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Oct. 10, 2008
Applicants:
Junsuke Tanaka, Tokyo, JP;
Akihisa Yamamoto, Tokyo, JP;
Makoto Maehira, Asaka, JP;
Yoshiyuki Mizuguchi, Tokyo, JP;
Inventors:
Junsuke Tanaka, Tokyo, JP;
Akihisa Yamamoto, Tokyo, JP;
Makoto Maehira, Asaka, JP;
Yoshiyuki Mizuguchi, Tokyo, JP;
Assignee:
TOPPAN PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/07 (2006.01); G06K 19/077 (2006.01); G06K 19/02 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); G06K 19/025 (2013.01); G06K 19/077 (2013.01); G06K 19/07745 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/181 (2013.01);
Abstract
A transponder includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet; a sealing material having electrical insulation is provided between the IC module and an inside face of the opening.