The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Apr. 01, 2017
Applicant:

Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;

Inventor:

Haoxiang Dong, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); G06K 9/00 (2006.01); H01L 31/0203 (2014.01); H05K 3/28 (2006.01); H05K 3/06 (2006.01); H01L 31/18 (2006.01); H01L 27/146 (2006.01); A61B 5/024 (2006.01); A61B 5/053 (2006.01); A61B 5/1455 (2006.01); A61B 5/1172 (2016.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); A61B 5/02416 (2013.01); A61B 5/0531 (2013.01); A61B 5/14551 (2013.01); G06K 9/0002 (2013.01); G06K 9/00114 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H05K 3/067 (2013.01); H05K 3/284 (2013.01); A61B 5/1172 (2013.01); A61B 2562/04 (2013.01); A61B 2562/12 (2013.01); A61B 2562/166 (2013.01); A61B 2562/242 (2013.01); A61B 2562/247 (2013.01); H01L 2924/15 (2013.01); H05K 2201/09818 (2013.01);
Abstract

A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (), a sensing module () disposed on an upper surface of the substrate () and electrically connected to the substrate (), and a package colloid () disposed on the upper surface of the substrate () and coating at least one portion of the sensing module (), wherein the sensing module () comprises a capacitive sensor () and an optical sensor (), and the package colloid () comprises at least one portion of a photic zone () disposed corresponding to the optical sensor (). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.


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