The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Nov. 09, 2015
Applied Materials, Inc., Santa Clara, CA (US);
Dermot Cantwell, Sunnyvale, CA (US);
Sathyendra Ghantasala, Fremont, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method for wafer point by point analysis includes receiving first recipe parameters for a first process recipe, second recipe parameters for a second process recipe, a first plurality of measurements of a plurality of locations on a first wafer processed using the first process recipe, and a second plurality of measurements of the plurality of locations on a second wafer processed using the second process recipe. A plurality of sensitivity values are calculated using the first and second values for the plurality of recipe parameters and the first and second plurality of measurements, each of the plurality of sensitivity values corresponding to one of the plurality of locations and representing a sensitivity to one of the plurality of recipe parameters. A graphical representation of a wafer is then provided that shows at least a subset of the first plurality of sensitivity values for the plurality of locations.