The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jun. 15, 2015
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Weihua Jia, Beijing, CN;

Peng Jiang, Beijing, CN;

Haipeng Yang, Beijing, CN;

Jaikwang Kim, Beijing, CN;

Yong Jun Yoon, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G02F 1/1362 (2006.01); G02F 1/133 (2006.01); G02F 1/136 (2006.01); G02F 1/1368 (2006.01); H01L 23/544 (2006.01); H01L 23/60 (2006.01); H01L 27/02 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
G02F 1/136204 (2013.01); G02F 1/133 (2013.01); G02F 1/136 (2013.01); G02F 1/1368 (2013.01); G02F 1/136209 (2013.01); G02F 1/136286 (2013.01); H01L 23/544 (2013.01); H01L 23/60 (2013.01); H01L 27/0292 (2013.01); H01L 27/0296 (2013.01); H01L 27/124 (2013.01); H01L 27/1259 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01);
Abstract

A display panel and manufacturing method thereof, and a display device are disclosed. The display panel includes an array substrate and a counter substrate. The array substrate includes a main region and a peripheral region, the main region coincides with an orthographical projection of the counter substrate on the array substrate, and at least one glue dispensing zone is arranged in the peripheral region or the main region. Conductive adhesive is provided in the glue dispensing zone, and is electrically connected to a grounded unit; an electrostatic conducting structure is provided on the counter substrate, and the conductive adhesive is electrically connected to the electrostatic conducting structure.


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