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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9932444 B1

PDFFull Text
Date of Patent:
Apr. 03, 2018

Filed:

Nov. 12, 2013

Semiaromatic polyamide, semiaromatic polyamide resin composition, and molded article

Applicant:

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Inventors:

Isao Washio, Chiba, JP;

Hiroki Ebata, Yokohama, JP;

Fumio Kageyama, Ichihara, JP;

Toshitaka Kosaka, Otake, JP;

Hideto Ogasawara, Sodegaura, JP;

Akinori Amano, Chiba, JP;

Nobuhiro Takizawa, Kamakura, JP;

Assignee:

MITSUI CHEMICALS, INC., Minato-Ku, Tokyo, JP;

Attorney:

Buchanan, Ingersoll & Rooney PC

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C08L 77/06 (2006.01); C08G 69/26 (2006.01); C08L 33/14 (2006.01); C08L 23/08 (2006.01); C08K 3/16 (2006.01); C08K 5/00 (2006.01); C08K 7/14 (2006.01); C08G 69/28 (2006.01); C08F 255/00 (2006.01); C08L 51/06 (2006.01);
U.S. Cl.
CPC ...
C08G 69/26 (2013.01); C08F 255/00 (2013.01); C08G 69/265 (2013.01); C08G 69/28 (2013.01); C08K 3/16 (2013.01); C08K 5/005 (2013.01); C08K 7/14 (2013.01); C08L 23/0815 (2013.01); C08L 33/14 (2013.01); C08L 77/06 (2013.01); C08L 51/06 (2013.01);
Abstract

To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.

Find Patent Forward Citations

Washio, Isao. (2018). Semiaromatic polyamide, semiaromatic polyamide resin composition, and molded article (U.S. Patent No. 9932444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9932444

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