The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Sep. 16, 2014
Applicant:
Daicel Corporation, Osaka-shi, Osaka, JP;
Inventors:
Tamaki Son, Ohtake, JP;
Takashi Kubo, Tokyo, JP;
Assignee:
DAICEL CORPORATION, Osaka-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C09D 5/00 (2006.01); C09D 163/00 (2006.01); C09D 163/08 (2006.01); C08K 3/04 (2006.01); G02B 1/04 (2006.01); C08L 63/00 (2006.01); C08G 59/68 (2006.01); G02B 1/00 (2006.01); G02B 5/00 (2006.01); C09J 163/00 (2006.01); C08G 59/38 (2006.01);
U.S. Cl.
CPC ...
C08G 59/687 (2013.01); C08G 59/24 (2013.01); C08K 3/04 (2013.01); C08L 63/00 (2013.01); C09D 5/00 (2013.01); C09D 163/00 (2013.01); C09D 163/08 (2013.01); C09J 163/00 (2013.01); G02B 1/00 (2013.01); G02B 1/04 (2013.01); G02B 5/003 (2013.01);
Abstract
Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: