The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Sep. 10, 2012
Misty Huang, New City, NY (US);
Richard W. Cruse, Yorktown Heights, NY (US);
Benjamin Falk, Yorktown Heights, NY (US);
Eric Pohl, Mount Kisco, NY (US);
Shiu-chin Su, Croton-on-Hudson, NY (US);
Jeries Nesheiwat, Yonkers, NY (US);
Philbert Ramdatt, New York, NY (US);
Thomas Fay-oy Lim, Killingworth, CT (US);
Vikram Kumar, Tarrytown, NY (US);
Misty Huang, New City, NY (US);
Richard W. Cruse, Yorktown Heights, NY (US);
Benjamin Falk, Yorktown Heights, NY (US);
Eric Pohl, Mount Kisco, NY (US);
Shiu-Chin Su, Croton-on-Hudson, NY (US);
Jeries Nesheiwat, Yonkers, NY (US);
Philbert Ramdatt, New York, NY (US);
Thomas Fay-Oy Lim, Killingworth, CT (US);
Vikram Kumar, Tarrytown, NY (US);
Momentive Performance Materials Inc., Waterford, NY (US);
Abstract
Moisture-curable resin compositions comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and cured compositions produced by contacting such resin compositions with water are disclosed. The moisture-curable resin composition is useful in the production of adhesives, including hot melt adhesives, primers, sealants, and coatings.