The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Dec. 24, 2013
Applicants:

Kurabe Industrial Co., Ltd., Hamamatsu-shi, Shizuoka, JP;

Toyoda Gosei Co., Ltd., Kiyosu-shi, Aichi, JP;

Inventors:

Masatsugu Saito, Hamamatsu, JP;

Yuki Naito, Hamamatsu, JP;

Bunpei Morita, Kiyosu, JP;

Atsushi Nagata, Kiyosu, JP;

Norio Umemura, Kiyosu, JP;

Assignees:

KURABE INDUSTRIAL CO., LTD., Shizuoka, JP;

TOYODA GOSEI CO., LTD., Aichi-pref., JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/36 (2006.01); B60L 1/02 (2006.01); B62D 1/06 (2006.01); H05B 3/16 (2006.01); H05B 3/56 (2006.01); B32B 37/10 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); H05B 3/34 (2006.01); H05B 3/00 (2006.01); H05B 3/18 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B62D 1/065 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/12 (2013.01); B62D 1/06 (2013.01); H05B 3/16 (2013.01); H05B 3/34 (2013.01); H05B 3/56 (2013.01); B29L 2031/3047 (2013.01); B32B 2605/08 (2013.01); H05B 3/0014 (2013.01); H05B 3/18 (2013.01); H05B 2203/003 (2013.01); H05B 2203/014 (2013.01); H05B 2203/017 (2013.01); Y10T 156/10 (2015.01);
Abstract

A heater unit includes a pair of substrates formed from a polymeric foam and a cord-shaped heater sandwiched between the pair of substrates. The thickness of a region of each of the substrates at which the cord-shaped heater is disposed is thinned relative to other regions of the substrates in such a manner as to be shaped to the cord-shaped heater and thus the heater unit forms a flat shape. In the heater unit, the substrates are bonded together by an adhesive layer that is composed only from a pressure-sensitive adhesive.


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