The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Sep. 30, 2009
Applicants:

Masahiro Tomamoto, Otsu, JP;

Michiharu Eta, Otsu, JP;

Hidetaka Oda, Otsu, JP;

Tatsuya Takaya, Otsu, JP;

Yasuo Yamazaki, Otsu, JP;

Hiroshi Takimoto, Otsu, JP;

Shinichi Ishibashi, Otsu, JP;

Keiji Takagi, Otsu, JP;

Daisuke Nagata, Otsu, JP;

Takahide Nakamura, Otsu, JP;

Toru Sakurabayashi, Otsu, JP;

Katsutoshi Fujiwara, Otsu, JP;

Mitsuharu Noda, Otsu, JP;

Yasuhiko Ogiso, Otsu, JP;

Takahide Fujii, Otsu, JP;

Inventors:

Masahiro Tomamoto, Otsu, JP;

Michiharu Eta, Otsu, JP;

Hidetaka Oda, Otsu, JP;

Tatsuya Takaya, Otsu, JP;

Yasuo Yamazaki, Otsu, JP;

Hiroshi Takimoto, Otsu, JP;

Shinichi Ishibashi, Otsu, JP;

Keiji Takagi, Otsu, JP;

Daisuke Nagata, Otsu, JP;

Takahide Nakamura, Otsu, JP;

Toru Sakurabayashi, Otsu, JP;

Katsutoshi Fujiwara, Otsu, JP;

Mitsuharu Noda, Otsu, JP;

Yasuhiko Ogiso, Otsu, JP;

Takahide Fujii, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 18/28 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
B32B 17/064 (2013.01); B65H 18/28 (2013.01); B65H 2801/61 (2013.01); Y10T 428/26 (2015.01);
Abstract

A glass roll reliably prevents a glass film from breaking from an end surface of the glass film as an origin of breakage. The glass roll is formed by winding the glass film into a roll while superposing the glass film on a protective sheet. The glass film is formed by an overflow downdraw method to have a thickness of 1 μm or more and 200 μm or less, and has each end surface in a width direction formed as a cut surface cut by laser splitting.


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