The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Jul. 05, 2016
Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventors:

Alan P. Rice, North Tustin, CA (US);

Andre Pratama, Tustin, CA (US);

Jeffrey Alan Wilson, Garden Grove, CA (US);

Firouz Felfeli, Irvine, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01R 4/02 (2006.01); H01R 12/72 (2011.01); H05K 1/02 (2006.01); H01R 43/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3405 (2013.01); H01R 4/027 (2013.01); H01R 12/722 (2013.01); H01R 43/205 (2013.01); H05K 1/0263 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01); H05K 2203/04 (2013.01);
Abstract

Coupling an electrical connector to a printed circuit board (PCB) involves disposing forms of conductive bonding agent on the PCB, pressing spring-loaded power pins of an electrical connector towards a surface of the PCB, heating the forms of conductive bonding agent, thereby at least partially melting the forms, pressing the spring-loaded power pins into the melted forms of conductive bonding agent, and holding the power pins in the forms until the forms have cooled enough to form a bond that holds the power pins, thereby forming an electrical connection between the one or more pins and the PCB. The spring-loaded power pins are configured to automatically lift away from the surface of the PCB when the bond is weakened.


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