The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Dec. 22, 2016
Applicant:

Yamaichi Electronics Co., Ltd., Tokyo, JP;

Inventors:

Yosuke Takai, Tokyo, JP;

Toshiyasu Ito, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/14 (2006.01); H01R 12/70 (2011.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01); G02B 6/42 (2006.01); H04Q 1/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); G02B 6/4277 (2013.01); H01R 12/7076 (2013.01); H04Q 1/14 (2013.01); H05K 1/0203 (2013.01); H05K 7/1461 (2013.01); H05K 7/20545 (2013.01); H05K 9/0015 (2013.01); H05K 9/0062 (2013.01); G02B 6/4284 (2013.01); H05K 2201/10189 (2013.01);
Abstract

In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector. The receptacle assembly includes a guide member provided on the periphery of the opening of the wiring board and configured to form a module accommodation portion to detachably accommodate the module comprising a module board and to guide the module, a connector unit provided on the wiring board and configured to electrically connect the module board of the module to the wiring board, a first EMI gasket sealing a gap between a lower end portion of a connector cover covering the connector unit and the wiring board, and a second EMI gasket sealing a gap between a connecting end portion of the module and the periphery of an opening of the connector unit.


Find Patent Forward Citations

Loading…