The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Dec. 25, 2012
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Michiya Kohiki, Hitachi, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); H05K 1/09 (2006.01); C25D 1/22 (2006.01); C25D 5/10 (2006.01); C25D 7/06 (2006.01); C25D 5/12 (2006.01); C25D 1/04 (2006.01); H05K 3/02 (2006.01); C25D 3/38 (2006.01); C25D 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C25D 1/04 (2013.01); C25D 1/22 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 7/0614 (2013.01); C25D 7/0621 (2013.01); C25D 7/0635 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); H05K 3/025 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/1545 (2013.01); Y10T 428/12438 (2015.01); Y10T 428/24917 (2015.01);
Abstract
Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less.