The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

May. 16, 2016
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Swarnal Borthakur, Boise, ID (US);

Ulrich Boettiger, Garden City, ID (US);

Richard A. Mauritzson, Meridian, ID (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/378 (2011.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/378 (2013.01); H01L 27/14621 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14698 (2013.01);
Abstract

An image sensor with an array of pixels is provided. The array may include a semiconductor substrate having opposing first and second sides. A first photodiode region may be implanted in the semiconductor substrate through the first side. A second photodiode region may be implanted in the semiconductor substrate through the second side. The second photodiode region may be implanted to overlap with the first photodiode region in the semiconductor substrate to form a continuous photodiode region that extends from the first side to the second side of the substrate. The continuous region may generate charge in response to image light. The continuous region may belong to a single pixel that generates an image signal from the charge. The image signal may be conveyed to readout circuitry via metallization layers formed over the substrate. The first and second photodiode regions may be thermally activated prior to forming the metallization layers.


Find Patent Forward Citations

Loading…