The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Sep. 26, 2016
Applicant:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Inventor:
Bang Hyun Kim, Ansan-si, KR;
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/62 (2010.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/0248 (2013.01); H01L 27/15 (2013.01); H01L 29/866 (2013.01); H01L 33/483 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2933/0033 (2013.01);
Abstract
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.