The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
May. 28, 2015
Applicant:
Seoul Viosys Co., Ltd., Ansan-si, KR;
Inventors:
Duk Il Suh, Ansan-si, KR;
Kyoung Wan Kim, Ansan-si, KR;
Yeo Jin Yoon, Ansan-si, KR;
Sang Won Woo, Ansan-si, KR;
Shin Hyoung Kim, Ansan-si, KR;
Assignee:
Seoul Viosys Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 33/38 (2010.01); H01L 27/15 (2006.01); H01L 33/32 (2010.01); H01L 33/42 (2010.01); H01L 33/14 (2010.01); H01L 29/861 (2006.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/387 (2013.01); H01L 27/15 (2013.01); H01L 29/861 (2013.01); H01L 33/145 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/42 (2013.01); H01L 33/38 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2933/0091 (2013.01);
Abstract
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. In the light emitting diode chip, the light emitting diode section is disposed together with the inverse parallel diode section.