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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9929309 B1

PDFFull Text
Date of Patent:
Mar. 27, 2018

Filed:

Jan. 30, 2015

Light-emitting diode package and method of manufacturing the same

Applicant:

Lightizer Korea Co., Seoul, KR;

Inventors:

Jae Sik Min, Anyang, KR;

Jae Young Jang, Anyang, KR;

Jae Yeop Lee, Anyang, KR;

Byoung Gu Cho, Anyang, KR;

Assignee:

LIGHTIZER KOREA CO., Seoul, KR;

Attorneys:

Hunter E. Webb

Keohane & D'Alessandro, PLLC

Primary Examiner:

Ermias Woldegeorgis

Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/44 (2013.01); H01L 33/505 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 33/507 (2013.01); H01L 33/641 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2933/0041 (2013.01);
Abstract

Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.

Find Patent Forward Citations

Min, Jae. (2018). Light-emitting diode package and method of manufacturing the same (U.S. Patent No. 9929309). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9929309

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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